As long as there are no issues with the initial test run we would expect that you will not experience any problems. It is further recommended that when you do the build with modules that have exceeded their shelf life that you start with a handful to perform a test run and do a final test to make sure all is working as expected. Humidity can affect solderability as well, as if there is any excess moisture in the solder on the module, during reflow of the module to the board, steam balls can essentially explode the solder and sometimes result in an open circuit (or possibly a short circuit).Īs long as all of the moisture handling and temperature guidelines are being followed you will likely have no issues. It is imperative those pads do not get tarnished, as this would cause soldering issues. Our main concern is around the castellation/pads which solder the module to the board. It is recommended that you follow IPC/JEDEC J-STD-033 which is the general standard for the handling, packing, shipping and use of moisture/reflow sensitive surface mount devices. Failure to bake the modules could result in the yield rate dropping down lower than expectation due to popcorn or de-lamination on the modules. However, when working with modules beyond their shelf life you MUST bake the modules before populating the them to your board. If the modules are still sealed in the package, stored at the proper temperature and have not been exposed to moisture they should be fine. The shelf life statements are essentially to prevent mishandling of the product and not storing it properly. REACH Chemical Analysis Chip Antenna ModuleįCC and ISED (Canada) Certifications - Sterling LWBĪpplication Note - PetaLinux Software Integration - 60 Series and LWB SeriesĪpplication Note - Supporting WPA3 Personal in LWB/LWB+/LWB5+ Product Change Notice 1-2017 (Sterling-LWB & LWB5) Sterling-LWB Safety Checklist Test ReportĬAD Files Sterling-LWB U.FL and Chip Antenna ModulesĬAD Files Sterling-LWB/LWB+ U.FL and Chip Antenna SD CardsĬAD Library Parts Sterling-LWB WICED Board In addition to the carrier board hardware, this comprehensive reference platform features extensive documentation and software examples, TiWiConnect™ cloud connectivity and ModuleLink™ mobile app for easy development and integration.Īpplication Note - Guidelines for Replacing Antennas v1.0 The low cost, pre-certified Sterling-LWB is now validated with the STM32F411 MCU and can be migrated to other popular MCU’s with an SDIO interface, giving you unmatched speed in adding Wi-Fi and BLE to your application. You can now leverage the high-performance Sterling-LWB module for embedded applications as well! The Sterling-LWB for WICEDTM reference platform provides a very simple and fast way to add both Wi-Fi and BLE 5.1 connectivity to your microcontroller-based design utilizing the power of Infineon’s robust WICED™ software development kit. Design implementation is straight-forward as well, as source CAD files make an outstanding starting point. Development is fast and easy with a carrier board that plugs directly into virtually any STM32F4xx Discovery Kit.
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